𝔖 Bobbio Scriptorium
✦   LIBER   ✦

New Epoxy Resins Cured with Tetraaminophenyladamantane (TAPA)

✍ Scribed by Qian Wei; Andrea Lazzeri; Flavia Di Cuia; Marco Scalari; Elena Galoppini

Publisher
John Wiley and Sons
Year
2004
Tongue
English
Weight
147 KB
Volume
205
Category
Article
ISSN
1022-1352

No coin nor oath required. For personal study only.

✦ Synopsis

Abstract

Summary: New epoxy materials are needed with low dielectric constants (Dk or ε~r~), low loss (Df or tan δ) in the giga‐hertz frequency range and high glass transition temperatures (T~g~s) for next generation fiber reinforced printed circuit boards. In this work, the incorporation of adamantane into an epoxy network has been investigated. In particular, this has been achieved by means of a new adamantane‐based, tetra‐functional crosslinking agent (1,3,5,7‐tetrakis(4‐aminophenyl)adamantane or TAPA) which was specifically synthesized and subsequently characterized for this study. The properties of EPON Resin 828 cured with the newly synthesized TAPA have been compared with the commonly used commercial curing agent 4,4′‐diaminodiphenylsulfone (DDS). It was found that the epoxy polymer cured with TAPA exhibited superior thermal properties as well as a good dielectric performance at high frequencies.
magnified image

📜 SIMILAR VOLUMES

New epoxy-imide resins cured with bis(hy
New epoxy-imide resins cured with bis(hydroxyphthalimide)s
✍ Toshihiro Ichino; Yoshonori Hasuda 📂 Article 📅 1987 🏛 John Wiley and Sons 🌐 English ⚖ 435 KB 👁 2 views

New epoxy-imide resins were synthesized using bis(hydroxyphthalimide)s (BHPIs). Among these resins, that cured with BHPI(DDS), synthesized from 4,4'-diaminodiphenykulfone, exhibits the best thermal resistance, reaching a tan8 maximum temperature of 230°C. This resin also features a tensile lap shear

Rubber-modified epoxy resins cured with
Rubber-modified epoxy resins cured with piperidine
✍ C. Salom; M.G. Prolongo; R.M. Masegosa; J. Baselga; A. Guemes 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 308 KB

Glass transition temperatures (Tg) of epoxy resins, diglycidyt ether of bisphenol-A cured with piperidine, have been measured by differential scanning calorimetry and dynamic mechanical thermal analysis in order to follow the curing process. Optimum cure conditions have been established as 30 PP at

Curing of epoxy resin contaminated with
Curing of epoxy resin contaminated with water
✍ Jingyuan Chen; Takahiro Nakamura; Koichi Aoki; Yuki Aoki; Toru Utsunomiya 📂 Article 📅 2000 🏛 John Wiley and Sons 🌐 English ⚖ 245 KB 👁 2 views
Curing reaction of epoxy resins with dia
Curing reaction of epoxy resins with diamines
✍ C. C. Riccardi; H. E. Adabbo; R. J. J. Williams 📂 Article 📅 1984 🏛 John Wiley and Sons 🌐 English ⚖ 532 KB

The curing reaction of a commercial bisphenol A diglycidyl ether (BADGE) with ethylenediamine (EDA) was studied by differential scanning calorimetry. Different kinetic expressions were found with isothermal (low temperature rafige) and dynamic (high temperature range) runs. Two competitive mechanism