✦ LIBER ✦

New epoxy-imide resins cured with bis(hydroxyphthalimide)s

✍ Scribed by Toshihiro Ichino; Yoshonori Hasuda

Publisher: John Wiley and Sons
Year: 1987
Tongue: English
Weight: 435 KB
Volume: 34
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1987.070340425

No coin nor oath required. For personal study only.

✦ Synopsis

New epoxy-imide resins were synthesized using bis(hydroxyphthalimide)s (BHPIs). Among these resins, that cured with BHPI(DDS), synthesized from 4,4'-diaminodiphenykulfone, exhibits the best thermal resistance, reaching a tan8 maximum temperature of 230°C. This resin also features a tensile lap shear adhesive strength of 320 kgf/cm2 when applied to steel test pieces. The cure reaction was followed by infrared spectroscopy and dynamic mechanical analysis. The ring-opening reaction between the phenolic hydroxyl group of BHPI and the epoxy group is observed, and accelerated by a tertiary amine catalyst, triethylamine.

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