New epoxy-imide resins were synthesized using bis(hydroxyphthalimide)s (BHPIs). Among these resins, that cured with BHPI(DDS), synthesized from 4,4'-diaminodiphenykulfone, exhibits the best thermal resistance, reaching a tan8 maximum temperature of 230Β°C. This resin also features a tensile lap shear
Cure of epoxy resins with a new dicarboxy-bis-azomethine
β Scribed by M. S. Chattha; J. C. Cassatta; W. O. Siegl
- Publisher
- John Wiley and Sons
- Year
- 1987
- Tongue
- English
- Weight
- 234 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
This work extends the authors' investigations on liquid crystalline epoxy resins prepared from diglycidyl ether of 4,4 -dihydroxybiphenyl (DGE-DHBP) and aliphatic dicarboxylic compounds (ADC) or difunctional aromatic compounds. Syntheses and properties of these liquid crystalline epoxy resins are de
## Abstract Vinylβterminated benzoxazine (VBβa), which can be polymerized through ringβopening polymerization, was synthesized through the Mannich condensation of bisphenol A, formaldehyde, and allylamine. This VBβa monomer was then blended with epoxy resin and then concurrently thermally cured to