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Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4′-diaminodiphenylmethane

✍ Scribed by Jungang Gao; Yanfang Li; Min Zhao; Guodong Liu

Publisher
John Wiley and Sons
Year
2000
Tongue
English
Weight
129 KB
Volume
78
Category
Article
ISSN
0021-8995

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