Rubber-modified epoxy resins cured with piperidine
β Scribed by C. Salom; M.G. Prolongo; R.M. Masegosa; J. Baselga; A. Guemes
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 308 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0014-3057
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β¦ Synopsis
Glass transition temperatures (Tg) of epoxy resins, diglycidyt ether of bisphenol-A cured with piperidine, have been measured by differential scanning calorimetry and dynamic mechanical thermal analysis in order to follow the curing process. Optimum cure conditions have been established as 30 PP at 120Β°C. Tgs of the neat epoxy system and those modified with 5 and 16% of a carboxyl-terminated reactive rubber copolymer of butadiene and acrylonitrile (CTBN) have been determined as a function of the cure time. Addition of 5% of CTBN does not modify the process, but the higher CTBN content accelerates the initial stage. Tgs after long cure times (T~) are lower for the modified systems than for the neat, showing that CTBN is not fully segregated. The amounts of CTBN dissolved in the epoxy crosslinked network have been estimated.
π SIMILAR VOLUMES
## Abstract **Summary:** New epoxy materials are needed with low dielectric constants (__Dk__ or __Ξ΅__~__r__~), low loss (__Df__ or tanβ__Ξ΄__) in the gigaβhertz frequency range and high glass transition temperatures (__T__~g~s) for next generation fiber reinforced printed circuit boards. In this wo