## Abstract Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with
Curing reaction of epoxy resins with diamines
✍ Scribed by C. C. Riccardi; H. E. Adabbo; R. J. J. Williams
- Publisher
- John Wiley and Sons
- Year
- 1984
- Tongue
- English
- Weight
- 532 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0021-8995
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✦ Synopsis
The curing reaction of a commercial bisphenol A diglycidyl ether (BADGE) with ethylenediamine (EDA) was studied by differential scanning calorimetry. Different kinetic expressions were found with isothermal (low temperature rafige) and dynamic (high temperature range) runs. Two competitive mechanisms are shown to be present: an autocatalytic one (activation energy E = 14 kcal/mol) and a noncatalytic path characterized by a second-order reaction with E = 24.5 kcal/mol. At low temperatures both mechanisms took place simultaneously, showing a significant decrease in the reaction rate after the gel point. At high temperatures only the noncatalytic reaction was present, without showing a noticeable rate decrease in the rubber region. Also, a third-order dependence of the glass transition temperature on reaction extent is shown.
📜 SIMILAR VOLUMES
## Abstract Diglycidyl ether of bisphenol‐A was cured, individually, with diaminoisopropyl benzene (DAIPB), diaminoethyl benzene (DAEB), blends of DAIPB/DAEB (up to 40 wt % DAEB), and DAIPB modified with up to 5 wt % amine‐terminated poly(butadiene‐co‐acrylonitrile) liquid rubber (ATBN). For each d