Cure kinetics of epoxy resins and aromatic diamines
β Scribed by Antonio Moroni; Jovan Mijovic; Eli M. Pearce; Cheu Ching Foun
- Publisher
- John Wiley and Sons
- Year
- 1986
- Tongue
- English
- Volume
- 32
- Category
- Article
- ISSN
- 0021-8995
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## Abstract Epoxy resins, 4, 4β²βdiglycidyl (3, 3β², 5, 5β²βtetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenolβA epoxy resin (DGEBA) cured with
The curing reaction of a commercial bisphenol A diglycidyl ether (BADGE) with ethylenediamine (EDA) was studied by differential scanning calorimetry. Different kinetic expressions were found with isothermal (low temperature rafige) and dynamic (high temperature range) runs. Two competitive mechanism