Reaction kinetics, thermal properties of
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Tiezhu Fu; Gang Zhang; Shuangling Zhong; Chengji Zhao; Ke Shao; Lifeng Wang; Hui
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Article
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2007
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John Wiley and Sons
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English
⚖ 250 KB
👁 2 views
## Abstract Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with