## Abstract Epoxy resins, 4, 4′‐diglycidyl (3, 3′, 5, 5′‐tetramethylbiphenyl) epoxy resin (TMBP) containing rigid rod structure as a class of high performance polymers has been researched. The investigation of cure kinetics of TMBP and diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) cured with
Cure kinetics of epoxy resin and aromatic diamines
✍ Scribed by M. Ghaemy; M. Barghamadi; H. Behmadi
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 121 KB
- Volume
- 94
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
## Abstract The effect of the molar ratio of diglycidyl ether of a bisphenol‐A based epoxy (DGEBA) and synthesized 4‐phenyl‐2,6‐bis(4‐aminophenyl)pyridine (PAP) as curing agent during nonisothermal cure reaction by the Kissinger, Ozawa, and isoconversional equations was studied. The cure mechanism
The cure kinetics of four epoxy/amine systems including commercial RTM6 and F934 resins have been investigated under both isothermal and dynamic curing conditions. Differential Scanning Calorimetry (DSC) was the thermoanalytical technique used to determine the cure kinetics of these resin systems. T