MKS Instruments Handbook: Semiconductor Devices and Process Technology - 9-2017
Acknowledgements
Forward
Table of Contents
SECTION A - Semiconductor Device Physics, Materials and Fabrication
I. Semiconductor Physics and Basic Device Structures
A. Semiconductor Physics
1. Electrical Characteristics of Solids
2. Electrical Conduction in Semiconductors
B. Basic Device Structures
1. P-N Junction
2. Diodes
3. Bipolar Junction Transistor
4. MOSFET
5. FinFETs
6. Other Common Semiconductor Devices
II. Semiconductor Materials
A. Bulk Crystalline Silicon and Compound Semiconductors
1. Electronic Grade Polycrystalline Silicon (Polysilicon)
2. Single Crystal Silicon Wafer Manufacture
3. Compound Semiconductor Wafer Production
B. Thin Films for Device Fabrication
1. Polycrystalline Silicon Thin Films
2. Epitaxial Thin Films
3. Dielectric Thin Films
4. Metal Thin Films for Contacts and Interconnects
III. Example Fabrication Process: CMOS Devices
A. Wafer Surface Cleaning
1. Contaminant Types and Solution Cleaning Methods
B. CMOS Device Structure
C. CMOS Process Steps
1. Pad Oxide (Thermal Oxidation)
2. Silicon Nitride
3. Shallow Trench Isolation (STI) Process
4. N- and P-Well Process
5. Gate Process
6. Contact Process
SECTION B - Process Equipment, Technology, and MKS Instrument's Product Applications
I. Vacuum Technology
A. Basic Concepts
B. Creating a Vacuum
C. Measuring Vacuum
D. Vacuum/Pressure Control
E. Residual Gas Analysis
II. Substrate Surface Cleaning
A. Piranha, SC1, SC2, RCA and DHF
B. โDryโ Substrate Cleaning
III. Ion Implantation
IV. Thermal Processing
A. Oxidation
B. Diffusion
C. Annealing
D. Rapid Thermal Processing
V. Thin Film Deposition
A. Chemical Vapor Deposition and Thin Film Formation
1. Low Pressure Chemical Vapor Deposition (LPCVD) Systems
2. Plasma Enhanced CVD (PECVD) Systems
3. Sub-Atmospheric Pressure CVD Systems
B. Atomic Layer Deposition (ALD)
C. Physical Vapor Deposition (PVD) Systems
VI. Photolithography
A. Basic Principles and Procedures
1. Deep UV (193 nm) Technology
2. Extreme Ultraviolet (EUV) Lithography at 13.5 nm
VII. Etch Technology
A. Basic Processes
B. Isotropic Radical Etching
C. Reactive Ion Etching
D. Physical Sputtering and Ion Milling
VIII. Chemical Mechanical Planarization
A. Chemical Mechanical Polishing/Planarization
B. CMP in Shallow Trench Isolation Processing
C. CMP in Damascene Processing
IX. Wafer and Reticle Inspection
A. Basic Principles
1. Unpatterned Wafer Inspection Systems
2. Patterned Wafers
3. Reticle Inspection
B. Advanced Wafer and Reticle Inspection Tools
1. Sub-100 nm Unpatterned Wafer Inspection
2. Sub-100 nm Patterned Wafer Inspection
3. Sub-100 nm Reticle Inspection
X. Automation of Process Equipment
XI. Semiconductor Fab Utilities
A. Ultrapure Water
B. Gas Storage and Delivery
C. Process Exhaust Gas Traps and Scrubbers
D. Cleanroom Air Supply System
Bibliography
Appendix A