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Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

✍ Scribed by Dhafer Abdul-Ameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Teh Guan Hoe, Fa Xing Che, Adnan Naama Abood

Book ID
113087420
Publisher
Springer US
Year
2012
Tongue
English
Weight
966 KB
Volume
41
Category
Article
ISSN
0361-5235

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