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The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x

✍ Scribed by Dhafer Abdul-Ameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Suhana Binti Mohd Said, Fa Xing Che

Book ID: 118801587
Publisher: Springer US
Year: 2012
Tongue: English
Weight: 882 KB
Volume: 23
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-012-0692-y

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