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Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders

✍ Scribed by Spinelli, José Eduardo; Garcia, Amauri

Book ID: 121580448
Publisher: Springer US
Year: 2013
Tongue: English
Weight: 873 KB
Volume: 25
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-013-1612-5

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