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Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders

✍ Scribed by Tina Ventura; Young-Hee Cho; Chun Kong; Arne K. Dahle

Publisher
Springer US
Year
2011
Tongue
English
Weight
355 KB
Volume
40
Category
Article
ISSN
0361-5235

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Sn-Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb-Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn-Cu eutectic alloy. In addition,