✦ LIBER ✦

Microcreep of rapidly solidified Sn–0.7 wt.% Cu–In solder alloys

✍ Scribed by Mustafa Kamal; Tarek El-Ashram

Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 356 KB
Volume: 456
Category: Article
ISSN: 0921-5093
DOI: 10.1016/j.msea.2007.01.056

No coin nor oath required. For personal study only.

✦ Synopsis

Sn-Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb-Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn-Cu eutectic alloy. In addition, we use the new technique, which has been developed by [Tarek El-Ashram, R.M. Shalaby, J. Electron. Mater., 34 (2005) 212-215.] to study the creep behavior of Sn-Cu-In alloys. The results showed that the hardness of Sn-Cu eutectic alloy was increased due to the addition of indium, however, the creep resistance was decreased, also Young's modulus was decreased and the resistivity was increased.

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Microcreep of rapidly solidified Sn–0.7&#xa0;wt.% Cu–In solder alloys

✦ Synopsis

Microcreep of rapidly solidified Sn–0.7 wt.% Cu–In solder alloys