𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Microstructure of rapidly solidified Cu–25 wt.% Cr alloys

✍ Scribed by Z.M. Zhou; Y.P. Wang; J. Gao; M. Kolbe

Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
526 KB
Volume
398
Category
Article
ISSN
0921-5093

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Microcreep of rapidly solidified Sn–0.7&
Microcreep of rapidly solidified Sn–0.7 wt.% Cu–In solder alloys
✍ Mustafa Kamal; Tarek El-Ashram 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 356 KB

Sn-Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb-Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn-Cu eutectic alloy. In addition,

Microstructural characterization of rapi
Microstructural characterization of rapidly solidified AlMnCr alloys
✍ Ping Liu; G.L Dunlop 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 924 KB

The microstructure of the A1-Mn-Cr alloys (AI-5Mn-2.5Cr, A1-5Mn-4Cr and A1-5Mn-6Cr), which were produced by ultrasonic gas atomization and hot extrusion, has been characterized by a combination of differential scanning calorimetry, microhardness measurement, X-ray diffraction, and analytical transmi