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Solidification of Sn-0.7Cu-0.15Zn Solder:In SituObservation

✍ Scribed by Zeng, Guang; McDonald, Stuart D.; Gourlay, Christopher M.; Uesugi, Kentaro; Terada, Yasuko; Yasuda, Hideyuki; Nogita, Kazuhiro

Book ID: 121576018
Publisher: The Minerals, Metals & Materials Society
Year: 2013
Tongue: English
Weight: 1019 KB
Volume: 45
Category: Article
ISSN: 1073-5623
DOI: 10.1007/s11661-013-2008-0

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