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Lead-Free Electronic Solders || Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications

✍ Scribed by Anderson, Iver E.

Book ID
120254107
Publisher
Springer US
Year
2007
Weight
769 KB
Category
Article
ISBN
0387484310

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At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We