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Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

✍ Scribed by M.N. Islam; Y.C. Chan; M.J. Rizvi; W. Jillek

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Lead-Free Electronic Solders || Developm

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Interfacial reactions of Sn-Ag-Cu solder

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Interfacial Reactions of Sn, Sn-3.0Ag-0.

✍ Yen, Yee-Wen; Hsieh, Yu-Ping; Jao, Chien-Chung; Chiu, Chao-Wei; Li, Yi-Shan 📂 Article 📅 2013 🏛 Springer US 🌐 English ⚖ 903 KB

Investigations of wetting properties of

✍ Chun-Chong Fu; Chih-chi Chen 📂 Article 📅 2011 🏛 Elsevier 🌐 English ⚖ 175 KB

Phase equilibria and the related propert

✍ I. Ohnuma; M. Miyashita; K. Anzai; X. J. Liu; H. Ohtani; R. Kainuma; K. Ishida 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 517 KB

Phase equilibria and thermodynamic prope

✍ Ohnuma, I.; Miyashita, M.; Xing Jun Liu, ; Ohtani, H.; Ishida, K. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 474 KB