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Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition

✍ Scribed by Sung K. Kang; Donovan Leonard; Da-Yuan Shih; Lynne Gignac; D. W. Henderson; Sungil Cho; Jin Yu

Book ID: 110626669
Publisher: Springer US
Year: 2006
Tongue: English
Weight: 405 KB
Volume: 35
Category: Article
ISSN: 0361-5235
DOI: 10.1007/bf02690535

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