✦ LIBER ✦

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

✍ Scribed by Li-Wei Lin; Jenn-Ming Song; Yi-Shao Lai; Ying-Ta Chiu; Ning-Cheng Lee; Jun-Yen Uan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of Cu concentration on morphology

✍ Szu-Tsung Kao; Jenq-Gong Duh 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 894 KB

Interfacial reactions of Sn-Ag-Cu solder

✍ Sung K. Kang; Donovan Leonard; Da-Yuan Shih; Lynne Gignac; D. W. Henderson; Sung 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 405 KB

Undercooling of Sn–Ag–Cu alloys: solder

✍ Hodaj, Fiqiri; Petit, Luc; Baggetto, Loïc; Boisier, Olivier; Verneyre, Lionel 📂 Article 📅 2013 🏛 Carl Hanser Verlag 🌐 English ⚖ 735 KB

Low-cycle fatigue behavior of Sn-Ag, Sn-

✍ Chaosuan Kanchanomai; Yukio Miyashita; Yoshiharu Mutoh 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 935 KB

Experimental and thermodynamic assessmen

✍ K. -W. Moon; W. J. Boettinger; U. R. Kattner; F. S. Biancaniello; C. A. Handwerk 📂 Article 📅 2000 🏛 Springer US 🌐 English ⚖ 655 KB

Lead-Free Electronic Solders || Developm

✍ Anderson, Iver E. 📂 Article 📅 2007 🏛 Springer US ⚖ 769 KB