Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-Based Solders

✍ Scribed by Kumar, P.; Zhe Huang; Chavali, S.C.; Chan, D.K.; Dutta, I.; Subbarayan, G.; Gupta, V.

• Book ID: 117913327
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2012
• Tongue: English
• Weight: 949 KB
• Volume: 2
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2173494