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Microsegregation in rapidly solidified Ag-15wt%Cu

✍ Scribed by W. Kurz; B. Giovanola; R. Trivedi


Book ID
103165705
Publisher
Elsevier Science
Year
1988
Tongue
English
Weight
223 KB
Volume
91
Category
Article
ISSN
0022-0248

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Sn-Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb-Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn-Cu eutectic alloy. In addition,