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Microsegregation in rapidly solidified Ag-15wt%Cu alloys

✍ Scribed by W.J. Boettinger; L.A. Bendersky; S.R. Coriell; R.J. Schaefer; F.S. Biancaniello


Book ID
107790035
Publisher
Elsevier Science
Year
1987
Tongue
English
Weight
866 KB
Volume
80
Category
Article
ISSN
0022-0248

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Sn-Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb-Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn-Cu eutectic alloy. In addition,