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Micro drilled ‘via holes’ in III-V semiconductors

✍ Scribed by Adarsh Sandhu

Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
587 KB
Volume
18
Category
Article
ISSN
0961-1290

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✦ Synopsis

Micro drilled 'via holes' in III-V semiconductors Etching backside via-holes in III-V semiconductors is a critical step in the process of fabricating Monolithic Microwave Integrated Circuits (MMIC), used for mixing, amplification and tuning signals in portable telephones and related communications equipment.

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