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UV laser micro hole drilling for III/V materials


Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
39 KB
Volume
18
Category
Article
ISSN
0961-1290

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Micro drilled โ€˜via holesโ€™ in III-V semic
โœ Adarsh Sandhu ๐Ÿ“‚ Article ๐Ÿ“… 2005 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 587 KB

Micro drilled 'via holes' in III-V semiconductors Etching backside via-holes in III-V semiconductors is a critical step in the process of fabricating Monolithic Microwave Integrated Circuits (MMIC), used for mixing, amplification and tuning signals in portable telephones and related communications e