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Material removal mechanism in chemical mechanical polishing: theory and modeling

✍ Scribed by Jianfeng Luo, ; Dornfeld, D.A.

Book ID
120262496
Publisher
IEEE
Year
2001
Tongue
English
Weight
537 KB
Volume
14
Category
Article
ISSN
0894-6507

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So far there is no consensus on the fundamental mechanism of material removal in chemical-mechanical polishing (CMP). Some researchers model the CMP process based on the mechanism proposed by Kaufman et al. [1], who attribute the material removal from the wafer surface to chemistry-aided mechanical