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Machining characteristics on the ultra-precision dicing of silicon wafer

โœ Scribed by Sung-Chul Kim; Eun-Sang Lee; Nam-Hun Kim; Hae-Do Jeong

Publisher
Springer
Year
2006
Tongue
English
Weight
229 KB
Volume
33
Category
Article
ISSN
0268-3768

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## Abstract Ultra precision machines are new generation of machine tools. They produce more accurate pieces in size and tolerance. Various rotational or linear movement mechanisms of these machines have been consisted of two main components; stationery or rail, and moving or slider. They are separa