Mirror polishing of silicon wafers (4th report) — development of bowl feed and double side polishing machine with In-situ thickness monitoring of silicon wafers: Nakamura, Takao; Akamatsu, Kiyoshi; Masuda, Masami Journal of the Japan Society of Precision Engineering. 1993 Apr; 59(4): 661–666

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 129 KB
• Volume: 16
• Category: Article
• ISSN: 0141-6359
• DOI: 10.1016/0141-6359(94)90092-2