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Surface integrity of silicon wafers in ultra precision machining

✍ Scribed by H.T. Young; H.T. Liao; H.Y. Huang

Publisher: Springer
Year: 2006
Tongue: English
Weight: 743 KB
Volume: 29
Category: Article
ISSN: 0268-3768
DOI: 10.1007/s00170-005-2508-1

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