𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Lubricating behavior in chemical–mechanical polishing of copper

✍ Scribed by Hong Liang; G Helen Xu

Book ID
114386890
Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
198 KB
Volume
46
Category
Article
ISSN
1359-6462

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Robust operation of copper chemical mech
Robust operation of copper chemical mechanical polishing
✍ Yi-Chung Kao; Cheng-Ching Yu; Shih-Haur Shen 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 843 KB

The unusual concentration effect in copper chemical mechanical polishing (CMP) is verified experimentally and operation-relevant models are derived. First, the well-known Preston equation is modified by taking the concentration effects into account. Next, a linear model is proposed to describe dishi

Chemical-mechanical polishing of copper
Chemical-mechanical polishing of copper for interconnect formation
✍ Z. Stavreva; D. Zeidler; M. Plötner; G. Grasshoff; K. Drescher 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 569 KB

A systematic study of Cu chemical-mechanical polishing (CMP) in terms of process parameters influence, planarization ability of the process and pattern sensitivity of the polish rate was performed. We examined the effects of Cu dishing and SiO z thinning and the reasons for them. Both were found to