𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Slurry for chemical/mechanical polishing copper alloys

Book ID
122967063
Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
155 KB
Volume
93
Category
Article
ISSN
0026-0576

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Copper chemical mechanical polishing usi
Copper chemical mechanical polishing using a slurry-free technique
✍ V.H. Nguyen; A.J. Hof; H. van Kranenburg; P.H. Woerlee; F. Weimar πŸ“‚ Article πŸ“… 2001 πŸ› Elsevier Science 🌐 English βš– 756 KB

A study of the chemical mechanical polishing (CMP) of thin copper films using fixed-abrasive pads is presented. The composition of the polishing solution is optimized by investigating the impact of both the oxidizer concentration and the pH of the solution on the polishing characteristics of copper.