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Glycolic acid in hydrogen peroxide-based slurry for enhancing copper chemical mechanical polishing

✍ Scribed by Tzu-Hsuan Tsai; Yung-Fu Wu; Shi-Chern Yen

Book ID: 108207380
Publisher: Elsevier Science
Year: 2005
Tongue: English
Weight: 514 KB
Volume: 77
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.10.008

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