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Hydrodynamics of Slurry Flow in Chemical Mechanical Polishing

✍ Scribed by Terrell, Elon J.; Fred Higgs, C.


Book ID
118139863
Publisher
The Electrochemical Society
Year
2006
Tongue
English
Weight
826 KB
Volume
153
Category
Article
ISSN
0013-4651

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Copper chemical mechanical polishing usi
✍ V.H. Nguyen; A.J. Hof; H. van Kranenburg; P.H. Woerlee; F. Weimar πŸ“‚ Article πŸ“… 2001 πŸ› Elsevier Science 🌐 English βš– 756 KB

A study of the chemical mechanical polishing (CMP) of thin copper films using fixed-abrasive pads is presented. The composition of the polishing solution is optimized by investigating the impact of both the oxidizer concentration and the pH of the solution on the polishing characteristics of copper.