✦ LIBER ✦
Chemical mechanical polishing of patterned copper wafer surface using water-soluble fullerenol slurry
✍ Scribed by Y. Takaya; H. Kishida; T. Hayashi; M. Michihata; K. Kokubo
- Publisher
- International Academy for Production Engineering
- Year
- 2011
- Tongue
- English
- Weight
- 428 KB
- Volume
- 60
- Category
- Article
- ISSN
- 0007-8506
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