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Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates

✍ Scribed by Chu-Hsuan Sha; Lee, C.C.


Book ID
119815874
Publisher
Institute of Electrical and Electronics Engineers
Year
2011
Tongue
English
Weight
1004 KB
Volume
1
Category
Article
ISSN
2156-3950

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