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Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films

✍ Scribed by Higurashi, E.; Imamura, T.; Suga, T.; Sawada, R.

Book ID: 119803929
Publisher: IEEE
Year: 2007
Tongue: English
Weight: 598 KB
Volume: 19
Category: Article
ISSN: 1041-1135
DOI: 10.1109/lpt.2007.908642

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