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Passive Alignment and Mounting of LiNbO Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au
✍ Scribed by Takigawa, R.; Higurashi, E.; Suga, T.; Kawanishi, T.
- Book ID
- 114571069
- Publisher
- IEEE
- Year
- 2011
- Tongue
- English
- Weight
- 897 KB
- Volume
- 17
- Category
- Article
- ISSN
- 1077-260X
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