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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation

✍ Scribed by Takigawa, Ryo; Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi

Book ID: 121282979
Publisher: IEEE
Year: 2009
Weight: 830 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270708

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