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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging

✍ Scribed by Zhao, Kun; Wang, Changhai

Book ID: 121254373
Publisher: IEEE
Year: 2009
Weight: 942 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270703

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