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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Numerical simulation on heat pipe for high power LED multi-chip module packaging

✍ Scribed by Li, Dongmei; Zhang, G. Q; Pan, Kailin; Ma, Xiaosong; Liu, Lei; Cao, Jinxue

Book ID: 121192354
Publisher: IEEE
Year: 2009
Weight: 808 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270726

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