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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study on thermo-mechanical reliability of embedded chip during thermal cycle loading

✍ Scribed by Niu, Ligang; Yang, D.; Zhao, Mingjun

Book ID: 120614433
Publisher: IEEE
Year: 2009
Weight: 812 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270625

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