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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Prediction of IMC formation during interfacial reactions: Application of CALPHAD approach to electronic package

✍ Scribed by Liu, Huashan; Zhu, WenJun; Jin, ZhanPeng

Book ID: 118026114
Publisher: IEEE
Year: 2009
Weight: 971 KB
Volume: 0
Category: Article
ISBN: 1424446589
DOI: 10.1109/icept.2009.5270606

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