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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - A core-shell structure viscoelastic model of particulate-filled electronic packaging polymers

✍ Scribed by Gui, Dayong; Liu, Jianhong; Chen, Bo; Miao, Xin; Zeng, Guangfu; Tian, Deyu

Book ID: 126674337
Publisher: IEEE
Year: 2009
Weight: 787 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270725

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