✦ LIBER ✦
Silver Joints Between Silicon Chips and Copper Substrates Made by Direct Bonding at Low-Temperature
✍ Scribed by Wang, P.J.; Lee, C.C.
- Book ID
- 118698530
- Publisher
- IEEE
- Year
- 2010
- Tongue
- English
- Weight
- 516 KB
- Volume
- 33
- Category
- Article
- ISSN
- 1521-3331
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