𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique

✍ Scribed by Zhang, Q. X.; Li, H. Y.; Tang, M.; Yu, A. B.; Liao, E. B.; Rong Yang, ; Lo, G. Q.; Balasubramanian, N.; Kwong, D. L.

Book ID: 121786199
Publisher: IEEE
Year: 2008
Weight: 612 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4550250

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2008 58th Electronic Components an

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - 3D silicon integration

✍ Knickerbocker, J.U.; Andry, P.S.; Dang, B.; Horton, R.R.; Patel, C S.; Polastre, 📂 Article 📅 2008 🏛 IEEE ⚖ 688 KB

[IEEE 2008 58th Electronic Components an

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Embedded capacitor technology: A real world example

✍ Smith, Norm; Fan, Jun; Andresakis, John; Fukawa, Yoshi; Harvey, Mark; Knighten, 📂 Article 📅 2008 🏛 IEEE ⚖ 591 KB

[IEEE 2008 58th Electronic Components an

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Band-pass-filter with balun function from IPD technology

✍ Kai Liu, ; Frye, Robert; Emigh, Roger 📂 Article 📅 2008 🏛 IEEE ⚖ 464 KB

[IEEE 2008 58th Electronic Components an

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Designing small footprint, low-cost, high-reliability packages for performance sensitive MEMS sensors

✍ Sarihan, Vijay; Jian Wen, ; Li, Gary; Koschmieder, Thomas; Hooper, Ryan; Shumway 📂 Article 📅 2008 🏛 IEEE ⚖ 390 KB

[IEEE 2008 58th Electronic Components an

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications

✍ Hongjin Jiang, ; Kyoung-sik Moon, ; Wong, C. P. 📂 Article 📅 2008 🏛 IEEE ⚖ 733 KB

[IEEE 2008 58th Electronic Components an

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Package design of pressure sensors for high volume consumer applications

✍ Shaw, Mark; Ziglioli, Federico; Combi, Chantal; Baldo, Lorenzo 📂 Article 📅 2008 🏛 IEEE ⚖ 662 KB