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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - 3D silicon integration

✍ Scribed by Knickerbocker, J.U.; Andry, P.S.; Dang, B.; Horton, R.R.; Patel, C S.; Polastre, R.J.; Sakuma, K.; Sprogis, E.S.; Tsang, C.K.; Webb, B.C.; Wright, S.L.

Book ID: 121289735
Publisher: IEEE
Year: 2008
Weight: 688 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ECTC.2008.4550025

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