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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules

✍ Scribed by Posada, G.; Carchon, G.; Nauwelaers, B.; De Raedt, W.

Book ID: 125475022
Publisher: IEEE
Year: 2008
Weight: 902 KB
Category: Article
ISBN: 1424422302
DOI: 10.1109/ectc.2008.4550268

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