Ion doping technology (IDT) for impurity doping is exactly one of the most important technology in the manufacturing of low temperature poly-silicon (LPS) TFT. Improvement of IDT are carried on according to more large-size glass and the requirement of LPS-TFTรs performance. IDT has become attractive
Low temperature poly-Si TFTs for display application
โ Scribed by In-Hyuk Song; Min-Koo Han
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 240 KB
- Volume
- 3
- Category
- Article
- ISSN
- 1567-1739
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โฆ Synopsis
We have fabricated new polycrystalline silicon (poly-Si) thin film transistors (TFTs) with a single grain-boundary by a simple excimer laser annealing (ELA) method which employs a selectively floating amorphous silicon (a-Si) active layer and Al patterns. A thermally insulating air-gap between the floating a-Si and substrate successfully induces the lateral grain growth. The proposed poly-Si TFT exhibits high mobility of 331 cm 2 /V s due to the high-quality grains. The other proposed method employs a lateral grain growth phenomenon obtained by excimer laser irradiation on an a-Si layer with pre-patterned aluminum film. The aluminum patterns act as a masking layer of incident laser beam for the selective melting of a-Si layer. The n-channel poly-Si TFT fabricated by the proposed method shows considerably improved I-V characteristics, such as high field effect mobility exceeding 240 cm 2 /V s.
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