We have fabricated new polycrystalline silicon (poly-Si) thin film transistors (TFTs) with a single grain-boundary by a simple excimer laser annealing (ELA) method which employs a selectively floating amorphous silicon (a-Si) active layer and Al patterns. A thermally insulating air-gap between the f
Ion doping system for low temperature poly-silicon TFT
β Scribed by Yoshinori Kawasaki
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 389 KB
- Volume
- 2
- Category
- Article
- ISSN
- 1567-1739
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β¦ Synopsis
Ion doping technology (IDT) for impurity doping is exactly one of the most important technology in the manufacturing of low temperature poly-silicon (LPS) TFT. Improvement of IDT are carried on according to more large-size glass and the requirement of LPS-TFTΓs performance. IDT has become attractive very much, because it is required the application for forming source/drain, LDD region and adjusting Vth.
We have developed ion doping system for large-size glass up to 730 Γ 920 mm 2 . It is focused to achieve using the sheet style (rectangular) beam and scanning glass, and currently we have developed the new system that has the function of mass separation of ion beam.
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